Thermal
Mentor: Dr. Carlos Coimbra
Team Leader: Cory Soon
Claude Phillips
Chae Min Lee
Didier Fusero
Scott Sufak
Lynnette Ramirez
Miko Suzuki
Luke Beaver
GOALS:
Background research on previously conducted CubeSat thermal analysis
Model heat transfer problem through network and computational modeling
Determine maximum and minimum temperatures the CubeSat will be exposed to in orbit
UPDATES:
| 2/04/02 - First meeting of thermal team. Discussed basic plan to follow for thermal analysis. All members are to perform a web search to see what type of thermal analysis other schools have performed (numerical/analytical, 2D/3D, steady/unsteady, etc.) Looked at sources of radiation incident on CubeSat. Discussed a preliminary 1-D network model to give a idea of the thermal conductivity required to transport the heat through the CubeSat frame. |
| 2/11/02 - Looked at the results of the websearch of other universities thermal analysis. Continued work on the network model and calculated the radiation/conduction Biot number (ratio of internal resistance over external resistance). The result showed that under some conditions the Biot number may be small enough so that the lumped thermal capacity approach can be applied. |
| 2/20/02 - Discussed different thermal software and possible methods of controlling temperature within satellite. |
| 2/25/02 - Decided on a code to use for numerical analysis. This is a resistance/capacitance method. Team members will be required to read information on the use of the code. |
| 3/11/02 - Change of plans. The thermal team will write their own code to model the heat transfer problem. The code will be a hybrid resistance-capacitance finite volume computer code. The learning experience, as well as the understanding of the what the code is doing will be much greater since the team is taking what they learned in heat transfer class and applying it to the coding of the CubeSat. |
| 3/12/02 - Preliminary Design Review night. Thermal team presented their plan for the thermal analysis and explained to the other subsystem teams what thermal design is and how it will ensure the safety of the payload. |
| 3/18/02 - Progress has been made in writing the code. Starting off with a solid cube of material with imposed heat fluxs. Hopefully we will be able to plot some results of the transient analysis soon. Still in need of the optical properties of the solar cells. The science team just delivered the operating temperature of their camera, 0° to 40° C. This is the narrowest range of temperature provided so far by the subsystem teams. |
| Spring Break - No meeting, however work will continue on the coding |
Other Things of Interest
| Thermal Properties of Electronic Components, partsTemp.xls | |||
| Group | Electronic Part | Manufacturer (link to product) | Operating Temp. |
| DCH | RabbitCore 2000 Microprocessor | Z-World | -40° to 85° C |
| DCH | Microchip EEPROM 24LC515 | Microchip | -40° to 85° C |
| ADS | Microcontroller | -55° to 125° C | |
| ADS | Sensors | -50° to 155° C | |
| SCI | Camera | 0° to 40° C | |
| PGD | Battery (Charge Temp) | 0° to 45° C | |
| TTC | Active Antenna | -10° to 60° C | |
Last Updated: 3/22/02